Aluminum oxide (Al2O3) thin films were deposited on Si (111) substrates by using RF magnetron sputtering of Al2O3 target in Ar atmosphere. The synthesized films were annealed in the temperature range of 200 to 600°C in nitrogen (N2) environment for 2 and 4 hours. Variations in these structural and surface properties of the films were investigated using X-ray diffraction (XRD) and atomic force microscope (AFM). XRD analysis reveals that the synthesized films are in polycrystalline form with preferential orientation along (111) plane. By increasing the annealing temperature, the crystallite size of films was found to increase, whereas the micro-strain and dislocation density were decreased. The decrease in micro-strain and dislocation density was ascribed to the reduction in the lattice strain. The surface roughness of the films was increased with the increase of the annealing temperature, which was attributed to the films’ grains growth and also with the increase in RF sputtering power.
Published in | International Journal of Materials Science and Applications (Volume 3, Issue 6) |
DOI | 10.11648/j.ijmsa.20140306.29 |
Page(s) | 404-409 |
Creative Commons |
This is an Open Access article, distributed under the terms of the Creative Commons Attribution 4.0 International License (http://creativecommons.org/licenses/by/4.0/), which permits unrestricted use, distribution and reproduction in any medium or format, provided the original work is properly cited. |
Copyright |
Copyright © The Author(s), 2014. Published by Science Publishing Group |
RF Sputtering, Aluminium Oxide, Thin Film
[1] | Kari Koski, Jorma HoÈlsaÈ, Pierre Juliet, “Properties of aluminium oxide thin films deposited by reactive magnetron sputtering”, Thin Solid Films 339 (1999), pp 240-241, 1999. |
[2] | Kari Koski, Jorma Holsa, Pierre Juliet, “Voltage controlled reactive sputtering process for aluminium oxide thin films”, |
[3] | Thin Solid Films 326 (1998), pp 189-190, 1998. |
[4] | Xiufeng Tang, Fa Luo, Fang Ou, Wancheng Zhou, Dongmei Zhu, Zhibin Huang, “Effects of negative substrate bias voltage on the structure and properties of aluminum oxide films prepared by DC reactive magnetron sputtering”, Applied Surface Science, pp 448-449, 2012. |
[5] | Myoung Yone Seo, Edward Namkyu Cho, Chang Eun Kim, Pyung Moon, and Ilgu Yun, “Characterization of Al2O3 Films grown by Electron Beam Evaporator on Si Substrates”, Nanoelectronics Conference (INEC), 2010 3rd International, pp 238, 2010. |
[6] | D. Carter, H. Walde, G. McDonough, G. Roche, “Parameter optimization in pulsed DC reactive sputter deposition of aluminum oxide”, Society of Vacuum Coaters (2002), pp 1-4, 2002. |
[7] | M. Voigt, M. Sokolowski, “Electrical properties of thin rf sputtered aluminum oxide films”, Materials Science and Engineering (2004), pp 1, 2004. |
[8] | Tsu-Tsung AndrewLi, SimonRuffell, MarioTucci, YvesMansoulie, ChristianSamundsett, Simona DeIullis, LucaSerenelli, AndresCuevas, “Influence of oxygen on the sputtering of aluminum oxide for the surface passivation of crystalline silicon”, Solar Energy Materials & Solar Cells 95 (2011), pp 69-70, 2011. |
[9] | H. Kakati, A. R. Pal, H. Bailung & Joyanti Chutia, “The influence of RF power and gas pressure on the surface characteristics of aluminium oxide deposited by RF magnetron sputtering plasma”, Journal of Physics: Conference Series 208 (2010) 012102, pp 1, 2010. |
[10] | H. Panitchakana and P. Limsuwan, “Characterization of Aluminum Oxide Films Deposited on Al2O3-TiC by RF Diode Sputtering”, Procedia Engineering 32 (2012), pp 902-903, 2012. |
[11] | Y. Kijima, T. Hanada, “Effect of the pressure of sputtering atmosphere on the physical properties of amorphous aluminum oxide films”, Journal of Master Science 35 (2000), pp 2193-2194, 2000. |
[12] | Koay Mei Hyie and Iskandar Idris Yaacob, “Annealing Behavior of Ferromagnetic FePt Nanoparticles Prepared in Water in Oil Microemulsions”, Proceedings of the World Congress on Engineering 2008 Vol II, pp 3-4, 2008. |
[13] | O. Lupan, T. Pauporte, L. Chow, B. Viana, F. Pelle, L.K. Ono, B. Roldan Cuenya, H. Heinrich, “Effects of annealing on properties of ZnO thin films prepared by electrochemical deposition in chloride medium”, Applied Surface Science 256 (2010), pp 1897-1899, 2010. |
[14] | A.R. Bushroa, R.G. Rahbari, H.H. Masjuki, M.R. Muhamad, “Approximation of crystallite size and microstrain via XRD line broadening analysis in TiSiN thin films”, Vacuum 86 (2012), pp 1107-1108, 2012. |
[15] | S. Shanmugan, S. Balaji, K. Ramathan, “Synthesis of ZnTe thin film using stacked elemental layer method: structural studies”, Optoelectronics and Advanced Materials – Rapid Communications Vol. 3, No. 5, May 2009, pp 468 – 471, 2009. |
[16] | M.Hakimi, P.Kameli, H.Salamati, Y.Mazaheri, “Evolution of microstructural and mechanical properties of nanocrystalline Co2FeAl Heusler alloy prepared by mechanical alloying”, pp 4-5, 2012. |
[17] | J.G. Quiñones-Galván, I.M. Sandoval-Jiménez, H. Tototzintle-Huitle, L.A. Hernández-Hernández , F. de Moure-Flores, A. Hernández-Hernández, E. Campos-González, A. Guillén-Cervantes, O. Zelaya-Angel, J.J. Araiza-Ibarra, “Effect of precursor solution and annealing temperature on the physical properties of Sol–Gel-deposited ZnO thin films”, Results in Physics 3 (2013) 248–253, pp 248-250, 2013. |
[18] | Davood Raoufi, Taha Raoufi, “The effect of heat treatment on the physical properties of sol–gel derived ZnO thin films”, Applied Surface Science 255 (2009), pp 5813-5815, 2009. |
[19] | M. K. Puchert, P. Y. Timbrell, and R. N. Lamb, “Postdeposition annealing of radio frequency magnetron sputtered ZnO films”, American Vacuum Society, pp 2224-2226, 1996. |
[20] | Zhiwei Zhao, and Beng Kang Tay, “Property study of aluminium oxide thin films by thermal annealing”, Phys. Status Solidi C 9, No. 1, 77–80 (2012), pp 78-79, 2011. |
[21] | Joydip Sengupta, R.K. Sahoo, K.K. Bardhan, C.D. Mukherjee, “Influence of annealing temperature on the structural, topographical and opticalproperties of sol–gel derived ZnO thin film”, Material Letter 65(2011) 2572-2574, pp 2573-2574, 2011. |
[22] | Yadun Zhao, Yitai Qian, Weichao Yu , Zuyao Chen, “Surface roughness of alumina films deposited by reactive r.f. sputtering”, Thin Solid Films 286 (1996), pp 46-47, 1996. |
APA Style
Lim Wei Qiang, Mutharasu Devarajan. (2014). Variation of Structural and Surface Properties of RF Sputtered Aluminum Oxide (Al2O3) Thin Films Due to the Influence of Annealing Temperature and Time. International Journal of Materials Science and Applications, 3(6), 404-409. https://doi.org/10.11648/j.ijmsa.20140306.29
ACS Style
Lim Wei Qiang; Mutharasu Devarajan. Variation of Structural and Surface Properties of RF Sputtered Aluminum Oxide (Al2O3) Thin Films Due to the Influence of Annealing Temperature and Time. Int. J. Mater. Sci. Appl. 2014, 3(6), 404-409. doi: 10.11648/j.ijmsa.20140306.29
AMA Style
Lim Wei Qiang, Mutharasu Devarajan. Variation of Structural and Surface Properties of RF Sputtered Aluminum Oxide (Al2O3) Thin Films Due to the Influence of Annealing Temperature and Time. Int J Mater Sci Appl. 2014;3(6):404-409. doi: 10.11648/j.ijmsa.20140306.29
@article{10.11648/j.ijmsa.20140306.29, author = {Lim Wei Qiang and Mutharasu Devarajan}, title = {Variation of Structural and Surface Properties of RF Sputtered Aluminum Oxide (Al2O3) Thin Films Due to the Influence of Annealing Temperature and Time}, journal = {International Journal of Materials Science and Applications}, volume = {3}, number = {6}, pages = {404-409}, doi = {10.11648/j.ijmsa.20140306.29}, url = {https://doi.org/10.11648/j.ijmsa.20140306.29}, eprint = {https://article.sciencepublishinggroup.com/pdf/10.11648.j.ijmsa.20140306.29}, abstract = {Aluminum oxide (Al2O3) thin films were deposited on Si (111) substrates by using RF magnetron sputtering of Al2O3 target in Ar atmosphere. The synthesized films were annealed in the temperature range of 200 to 600°C in nitrogen (N2) environment for 2 and 4 hours. Variations in these structural and surface properties of the films were investigated using X-ray diffraction (XRD) and atomic force microscope (AFM). XRD analysis reveals that the synthesized films are in polycrystalline form with preferential orientation along (111) plane. By increasing the annealing temperature, the crystallite size of films was found to increase, whereas the micro-strain and dislocation density were decreased. The decrease in micro-strain and dislocation density was ascribed to the reduction in the lattice strain. The surface roughness of the films was increased with the increase of the annealing temperature, which was attributed to the films’ grains growth and also with the increase in RF sputtering power.}, year = {2014} }
TY - JOUR T1 - Variation of Structural and Surface Properties of RF Sputtered Aluminum Oxide (Al2O3) Thin Films Due to the Influence of Annealing Temperature and Time AU - Lim Wei Qiang AU - Mutharasu Devarajan Y1 - 2014/12/18 PY - 2014 N1 - https://doi.org/10.11648/j.ijmsa.20140306.29 DO - 10.11648/j.ijmsa.20140306.29 T2 - International Journal of Materials Science and Applications JF - International Journal of Materials Science and Applications JO - International Journal of Materials Science and Applications SP - 404 EP - 409 PB - Science Publishing Group SN - 2327-2643 UR - https://doi.org/10.11648/j.ijmsa.20140306.29 AB - Aluminum oxide (Al2O3) thin films were deposited on Si (111) substrates by using RF magnetron sputtering of Al2O3 target in Ar atmosphere. The synthesized films were annealed in the temperature range of 200 to 600°C in nitrogen (N2) environment for 2 and 4 hours. Variations in these structural and surface properties of the films were investigated using X-ray diffraction (XRD) and atomic force microscope (AFM). XRD analysis reveals that the synthesized films are in polycrystalline form with preferential orientation along (111) plane. By increasing the annealing temperature, the crystallite size of films was found to increase, whereas the micro-strain and dislocation density were decreased. The decrease in micro-strain and dislocation density was ascribed to the reduction in the lattice strain. The surface roughness of the films was increased with the increase of the annealing temperature, which was attributed to the films’ grains growth and also with the increase in RF sputtering power. VL - 3 IS - 6 ER -